‘Technical Specifications for Synergistic Self-heating Melting of Used Circuit Boards’ Initiated by CECEP Engineering Technology Research Institute Released

Initiated and drafted by CECEP Engineering Technology Research Institute, the “Technical Specifications for Synergistic Self-heating Melting of Used Circuit Boards” (T/CAEE2-2021) was officially released on May 20, 2021. China’s first technical specifications for clean recycling of used circuit boards, the standard will serve as a guiding document for green development of used circuit boards as a resource and will greatly promote the influence of Chinese energy-saving technology brands.

Initiated and drafted by CECEP Engineering Technology Research Institute, the “Technical Specifications for Synergistic Self-heating Melting of Used Circuit Boards” (T/CAEE2-2021) was officially released on May 20, 2021. China’s first technical specifications for clean recycling of used circuit boards, the standard will serve as a guiding document for green development of used circuit boards as a resource and will greatly promote the influence of Chinese energy-saving technology brands.